MATEK manufactures backing plates for nearly all conventional sputtering systems and can also custom design special assemblies. Whether you require OFE copper, stainless steel, molybdenum or aluminum. MATEK can provide the dimensional tolerances to fit your needs. All backing plates are fabricated on numerically controlled equipment to further ensure absolute reproducibility.

Bonding Services

MATEK provides all metal bonding to affix sputtering targets to backing plates for systems which do not utilize a bolt-on target assembly. This proprietary process utilizes layers of low vapor pressure metals which have been applied to both the backing plate and the target and are then diffusion bonded together. This bond not only provides the necessary mechanical strength required to hold the two materials together, but it also provides a high thermally and electrically conductive layer for transfer of heat and electricity from the backing plate to the target. In addition, this material provides a differential slip plane to allow for differences in thermal expansion between the target and the backing plate. This prevents the target from debonding or cracking during the heat up and cool down cycle of the plasma deposition process.

We has developed a unique back-sputtering technique for metallizing targets and backing plates for adhesion layers. Our extensive background in engineering materials and joining techniques, and experience in stress reduction has allowed it to pioneer several approaches to bonding brittle materials of low to intermediate thermal expansion to high-integrity metallurgical bonds and help customers achieve optimal process performance.